Especially developed for better sliding and wear resistance at high emperature applications.
Series of Tecasint 1000: have very high modulus, high rigidity and hardness.
It contains 15% praphite and 10% PTFE.
TECASINT is a range of non-melting high temperature polyimides characterized by high strength over a wide range of temperatures, good long term thermal stability, minimal thermal expansion and excel. Ensinger TECASINT 5051 Polyimide, 30% Glass Fiber Filled (PI) Ensinger TECASINT 5051 Polyimide, 30% Glass Fiber Filled (PI) Category.
Properties | Unit | Method | Value |
---|---|---|---|
Colour | |||
Density | g/cm3 | DIN EN ISO 1183 | 1.48 |
Flammability (UL94) | - | DIN IEC 60695-11-10 | V0 |
Water absorption in air, 24 h / 96 h, (23ºC) | % | DIN EN ISO 62 | |
Dielectric constant | - | IEC 60250 | |
Volume resistivity | Ω*cm | IEC60093 | |
Surface resistivity | Ω | IEC60093 | |
Dielectric strength | kV/mm | IEC 60243 | |
Dielectric dissipation factor (50 Hz) | - | IEC60 250 | |
Comparative tracking index (CTI) | - | IEC 60112 | |
Thermal conductivity | W/ (K.m) | ISO 22007-4:2008 | |
Chemical resistance at 23ºC: deluted acids | - | ||
Chemical resistance at 23ºC: strong acids | - | ||
Chemical resistance at 23ºC: aliphatic hydrocarbons | - | ||
Chemical resistance at 23ºC: chlorin dissolvents | - | ||
Chemical resistance at 23ºC: alcohols | |||
Chemical resistance at 23ºC: deluted bases | - | ||
Chemical resistance at 23ºC: strong bases | - | ||
Chemical resistance at 23ºC: aromatic hydrocarbons | - | ||
Melting temperature | ºC | ISO 11357-3 | |
Glass transition temperature | ºC | DIN 53765 | 330 |
Specific heat | J/(g.K) | ISO 22007-4:2008 | |
Coefficient of linear thermal expansion (CLTE): 23 - 60ºC | m/(m.K)x10-5 | DIN EN ISO11359-1;2 | |
Coefficient of linear thermal expansion (CLTE): 23 - 100ºC | m/(m.K)x10-5 | DIN EN ISO11359-1;2 | |
Max. allowable service temperature in air, short term | ºC | ||
Max. allowable service temperature in air, long term | ºC | ||
Min. allowable service temperature in air, long term | ºC | ||
Heat deflection temperature | ºC | DIN EN ISO 75, A | |
Yield stress | MPa | DIN EN ISO 527-2 | |
Modulus of elasticity (tensile test) | MPa | DIN EN ISO 527-2 | |
Elongation at break | % | DIN EN ISO 527-2 | 2.9 |
Flexural strength | MPa | DIN EN ISO 178 | 120 |
Impact strength, Charpy | kJ/m2 | DIN EN ISO 179-1eU | 25.8 |
Tensile strength | MPa | DIN EN ISO 527-2 | 77 |
Compressive strength | MPa | EN ISO 6041% / 2% | |
Notched impact strength, charpy | kJ/m2 | DIN EN ISO 179-1eA | 3.9 |
Ball indentation hardness | MPa | ISO 2039-1 | |
Shore D hardness | - | DIN EN ISO 868 |
5051 is an optically clear, low viscosity, electrically isolating epoxy compound. It bonds well to most substrates such as metals, glass, ceramics, and most plastics. The material is free flowing, making it ideal for potting and underfill applications.
Work Life @ 25°C | 8 hours |
---|---|
Mixed Viscosity @ 25°C | 320 cPs |
Pot Life @ 25°C | 4 hours |
Shelf Life | 12 months @ 25°C (2‐part Kits)12 months @ ‐40°C (Cryo‐Pac®) |
Mix Ratio | 100A : 34.5B Parts By Weight |
6 hours @ 80°C8 hours @ 65°C8 days @ 25°C
Color | Clear |
---|---|
Shore D Hardness | 83 |
Glass Transition Temp (°C) | 85 |
Lap Shear 2024T3 Clad (psi) | 3,300 |
Density (g/cc) | 1.15 |
Refractive Index | 1.56 |
Shrinkage Linear (%) | 0.2 |
Based on cure of 6 hours @ 80°C
Dielectric Constant | 3.013 @ 60 Hz3.052 @ 1k Hz2.846 @ 100k Hz |
---|---|
Dissipation Factor | 0.0061 @ 60 Hz0.0118 @ 1k Hz0.0382 @ 100k Hz |
Volume Resistivity (ohm‐cm) | 1.7E 16 @ 500 VDC |
Glass Transition Temp (°C) | 85 |
---|---|
Degradation Temp. (°C) | 250 |
Based on cure of 6 hours @ 80°C
TML (%) | 0.58 |
---|---|
CVCM (%) | 0.01 |
WVR (%) | 0.26 |
Based on cure of 6 hours @ 80°C
Velocity (m/s) | 2,645 |
---|---|
Impedance (MRayles) | 3.05 |
Loss (dB/cm-MHz) | -6.2 |
Density (g/cc) | 1.15 |
The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.
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